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Shenzhen Chenghe Electronic Industrial Co.,Ltd

Showing 11 - 15 of 15, total 2 pages        [First] [Previous] [Next] [Last]

11
pcb
pcb
Specification: Mulit layer Plating Gold PCB
Detail: Our PCB Production Capability Base Material FR4/CEM/Aluminum/Non-halogen Layer Count 1-10 layer Thickness of Board 0.2-3.0mm Thickness of Base Copper 17um-105um Finishing HAL(LF)/Immersion gold/Plating gold/Gold ...

12
pcb
pcb
Specification: Mulit layer HAL LF board
Detail: Our PCB Production Capability Base Material FR4/CEM/Aluminum/Non-halogen Layer Count 1-10 layer Thickness of Board 0.2-3.0mm Thickness of Base Copper 17um-105um Finishing HAL(LF)/Immersion gold/Plating gold/Gold ...

13
pcb
pcb
Specification: 4-layer ENIG PCB board
Detail: Our PCB Production Capability Base Material FR4/CEM/Aluminum/Non-halogen Layer Count 1-10 layer Thickness of Board 0.2-3.0mm Thickness of Base Copper 17um-105um Finishing HAL(LF)/Immersion gold/Plating gold/Gold ...

14
pcb
pcb
Specification: Double layer pcb board
Detail: Our PCB Production Capability Base Material FR4/CEM/Aluminum/Non-halogen Layer Count 1-10 layer Thickness of Board 0.2-3.0mm Thickness of Base Copper 17um-105um Finishing HAL(LF)/Immersion gold/Plating gold/Gold ...

15
printed circuit board
printed circuit board
Specification: Double layer pcb board
Detail: Our PCB Production Capability Base Material FR4/CEM/Aluminum/Non-halogen Layer Count 1-10 layer Thickness of Board 0.2-3.0mm Thickness of Base Copper 17um-105um Finishing HAL(LF)/Immersion gold/Plating gold/Gold ...
Showing 11 - 15 of 15, total 2 pages        [First] [Previous] [Next] [Last]
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Tel : 86-755-27335776-807 Fax : 86-755-27335836
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